TensorNova
TensorNova
Premium 1U, 2U, and 4U systems certified for immediate deployment across enterprise data centers and hybrid-cloud clouds.
In the digital-first economy, the backbone of enterprise computing must not only deliver high FLOPS and high throughput, but also strictly adhere to international quality, safety, and compatibility standards. As global industries move rapidly towards hybrid clouds, artificial intelligence models, and distributed edge frameworks, CE certification represents a vital prerequisite for legal importation, integration, and secure operability within the European Economic Area (EEA) and beyond.
CE Certification ensures that high-power server nodes conform with crucial Directives, specifically the Low Voltage Directive (LVD) 2014/35/EU and the Electromagnetic Compatibility (EMC) Directive 2014/30/EU. By working with certified server manufacturing partners, enterprise CIOs reduce the critical risk of system electrical failure, severe signal attenuation in multi-rack clusters, and catastrophic fire hazards in dense data center racks.
"Compliance with CE requirements isn't merely a checkbox for border customs. It is a fundamental seal of product integrity that verifies the system's thermal limits, signal integrity shielding, and high-frequency grounding schemas under maximum computational workloads."
Our infrastructure solutions go through stringent testing pipelines, including automated hardware stress tests, thermal profiling across varying chassis layouts, continuous burn-in, and intensive AI simulation runs.
Our vast manufacturing footprint relies on a resilient component network, providing highly secure and stable component supplies for high-demand PCIe Gen 5.0 systems, advanced RAID controller cards, and SSD arrays.
A leading high-performance AI GPU server manufacturer and infrastructure solution provider engineering global data-center hardware.
Headquartered in China's manufacturing clusters, TensorNova specializes in AI computing, dense GPU cluster topologies, and highly customizable bare-metal server integrations. Supported by a state-of-the-art 320㎡ dedicated facility optimized for rapid hardware system integration and strict thermal verification, the company brings over 12 years of industry experience to the field. Our manufacturing lines run on complex ISO9001-certified processes, allowing us to launch 320+ new products annually, catering to demanding AI startups, scale-out cloud service providers, and research centers in North America, Europe, Singapore, and the Middle East.
Navigating the transition to PCIe Gen 6.0, direct-to-chip liquid cooling systems, and Compute Express Link (CXL) architectures.
Integrating next-gen Xeon Scalable processors with PCIe Gen 5.0 channels to double system interconnect bandwidth. Standardizing hybrid cooling loops capable of handling 350W+ CPU thermal envelopes and high-density, multi-GPU configurations safely within typical 2U chassis form factors.
Transitioning architecture designs to leverage CXL protocols, which enable high-speed CPU-to-device cache coherence. This transition allows data centers to build shared memory reservoirs, greatly decreasing overall memory resource waste and maximizing efficiency for large language model inference clusters.
Designing chassis optimized specifically for dielectric immersion baths, aiming for operating Power Usage Effectiveness (PUE) below 1.1. In parallel, transitioning motherboard copper lanes to high-speed optical traces to prevent impedance and signal degradation at extreme frequencies.
The global server market demands not only innovation but swift and dependable component sourcing. Located within China's primary high-tech production hub, our assembly lines benefit from immediate access to the world's most dense electronic component cluster. This location enables rapid turnarounds for customized motherboard revisions, chassis modifications, and high-frequency backplane fabrication.
By leveraging more than 1,200 verified hardware partners and global component suppliers, TensorNova mitigates chip-shortage risks. This vast supply ecosystem ensures that complex BOM (Bill of Materials) configurations—spanning high-capacity server SSDs, RAID controller cards, and specific power distribution units (PDUs)—can be quickly gathered, built, and shipped worldwide.
How our CE-certified platforms solve unique computational and environmental challenges across diverse sectors.
Deploying multi-GPU platforms in scientific clusters to train deep learning models. High-speed interconnect layouts minimize latency during distributed model updates, maintaining stable operation in highly dense compute nodes.
Providing 4-socket configurations designed for complex SAP HANA databases and critical transaction backbones. Advanced internal architecture provides sufficient memory expandability to handle dense, real-time analytics queries without system bottlenecks.
Delivering compact, short-depth 1U/2U servers to edge telecommunication centers. Integrated electromagnetic shielding prevents interference with nearby RF transmitters, complying fully with CE EMC limits.
With data sovereignty laws like GDPR in the European Union and regulatory oversight across North America and APAC, bare-metal server deployments must balance performance with rigorous security certifications. In these highly regulated environments, CE-compliant server systems assure operators that the equipment is safe to run within public utilities, bank networks, and large cloud farms.
Furthermore, CE certification aligns directly with international standards such as IEC 62368-1 (Safety Requirements for Audio/Video, Information, and Communication Technology Equipment). By design, our chassis structures feature fire-resistant materials, secure electrical isolation to protect technicians during hot-swap maintenance, and low-leakage power systems that minimize idle power consumption and lower operational TCO.
Our global shipping model is supported by verified local testing partnerships. Every server batch undergoes rigorous stress testing prior to departure, arriving ready to pass import regulations and local data center audits.
Answering critical engineering and regulatory questions for IT procurement teams and data center architects.
CE compliance requires servers to undergo Electromagnetic Compatibility (EMC) testing under EN 55032 (emission limits) and EN 55035 (immunity limits), as well as Low Voltage Safety testing under EN 62368-1. These tests ensure the hardware limits electromagnetic emissions to prevent interference with other electronic equipment and is safe against electrical overloads, overheating, and mechanical hazards.
We optimize server layouts using Computational Fluid Dynamics (CFD) simulations to guide custom air baffles, high-performance fans, and targeted liquid cooling options. For intense compute servers, custom cold plates route cooling directly to processors and GPUs, efficiently extracting heat in 2U and 4U chassis profiles.
We offer complete OEM/ODM customization options. Our R&D engineering team can modify PCIe lane distributions, customize high-efficiency cooling loops, customize BIOS and firmware options, design specialized server chassis layouts, and tune BIOS profiles for specific AI datasets or databases.
Through over 12 years in the computing industry, we have established strategic agreements with major semiconductor fabricators and built a reliable network of over 1,200 suppliers. We manage risks through component inventory reserves and qualify alternative components for secondary layouts, ensuring steady production schedules.
Explore our high-density storage nodes and hybrid GPU workstations designed for modern data centers.
A tour inside our ISO9001-certified integration bays, component testing rooms, and system diagnostics departments.
